Coating technology

PVD system

CemeCon CC800/9 Custom

General:

Manufacturer: CemeCon AG

  • PVD coating system for reactive or non-reactive sputtering processes
  • equipped with six "Unbalanced Magnetron" evaporators
  • Production of multilayer and nanolayer structures in one process step when loaded with different target materials
  • Fabrication of hard material layers such as TiN, TiB2, ZrN, TiCN by introducing reactive process gases.

Technical data:

Coating chamber: 800 mm x 800 mm x 1,000 mm (length x width x height).

number of cathodes: 6

Cathode size (target): 500 mm x 88 mm

Cathode power: 8 KW

Heating power: front, rear heating max. 8,8 kW; middle heating max. 15 kW

Operating modes: 4 cathodes: DC mode / pulsed MF mode,

2 cathodes HPPMS (high power pulsed magnetron sputtering)

Substrate table: Ø 400 mm with six planetary drives Ø 130 mm

Bias substrate table up to 1200V

Pumps: 2 turbo pumps; 1 rotary vane pump

Gases: Argon, nitrogen, acetylene, krypton, oxygen

PPA coating plant

Plasma-Pulver-Anlage der Firma Hettiger

Energy source: transferred electric arc

Filler material forms: Powder/powder mixtures, two-powder technique possible

Application areas: local and large-area hardfacing of new parts, repair welds

Process-specific advantages: high hard material contents can be realized, high coating performance, all powdered alloys can be processed, low mixing and low rework

Max. Currents: 600 A for main arc,200 A for pilot arc

Max. Feeding speed: 500 mm/min